On July 9th, Mr. Masahiko Mori, President and CEO of DMG MORI, led a delegation to visit TESID for an inspection and exchange. This in-depth interaction bringing together top industry expertise not only reflects high recognition of TESID's precision manufacturing capabilities but also marks an important starting point for both parties to explore technological collaboration and future cooperation.

During the inspection, Mr. Kou accompanied Mr. Masahiko Mori to visit the core areas of TESID's production base, focusing on the machining center and assembly center. In the machining center, Mr. Kou first introduced the application of multiple high-precision DMG MORI processing equipment in TESID's production: "DMG MORI's equipment is the core force of our machining center. From the NTX3000 5-axis turn-mill complex machining center to the NHC5500 horizontal machining center automated production line, these devices undertake the precision machining tasks of key components such as spindles. The stable performance of DMG MORI equipment has laid a solid foundation for the precision of TESID's complete machines."

Though brief, the inspection is of far-reaching significance. Before leaving, Mr. Masahiko Mori said: "TESID's technical accumulation and innovative spirit in the field of precision manufacturing are impressive. We look forward to promoting in-depth cooperation in technology research and development and market expansion through specific projects in the future." In response, Mr. Kou said: "DMG MORI's global vision and technological foresight have provided us with valuable insights and set a direction for us to learn from."

This in-depth interaction between TESID and DMG MORI has not only laid a solid foundation for their subsequent cooperation but also will promote technological exchanges and innovative breakthroughs in the field of precision grinding. In the future, it is expected that TESID and DMG MORI will take technology as a bridge and trust as the foundation to jointly write a new chapter in precision grinding.